BGA rework with underfill
Advanced rework technology! It prevents the concentration of stress that occurs on the connection surface of solder balls.
BGA is mounted on the printed circuit board by solder balls. Due to weak connection strength, there may be cases where the reliability of the connection cannot be maintained due to the detachment of the BGA or the occurrence of cracks at the solder joints in response to external stresses such as impact or bending. To address such issues and improve connection reliability, a sealing resin called underfill is used in the gap between the component and the board. 【Features】 ■ Uses a one-component heat-curing epoxy resin ■ Can reduce external stresses ■ Prevents concentration of stress at the connection surfaces of the solder balls ■ Widely used in mobile devices such as mobile phones and music players *For more details, please refer to the PDF document or feel free to contact us.
- Company：ケイ・オール
- Price：Other
